Camera Modules
CMP Technology

The CMP (Chip Miniaturized Package)  technology realizes the full package of the Sensor WB gold wire and MLCC components in the product through the plastic sealing technology, and realizes the smaller module package size with the integrated lens. This packaging technology can be packaged with the current mainstream Sensor and the mature CCM lens system. The product is extremely flexible, and meets the high quality image quality of the customer and the smaller module package size to further enhance screen-o-body ratio of full screen of the mobile phone.

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